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specialty polymers advancedengineering defense/electronics/optoelectronics

CF-4721

THERMOSETTING SILICONE RESIN

 

Description

  • A solvent-free, thermosetting resin
  • Forms a transparent, rigid material that retains its cured properties over a broad temperature range (up to 300°C/570°F)
  • Has good dielectric properties at high temperatures and humidity
  • Excellent resistance to radiation
  • 100:1 Mix Ratio (CF-4721:Dicumyl Peroxide)

Applications

  • For encapsulating electrical and electronic units
  • For electronics and photonics applications

Product Details

Property Average result
Refractive Index 1.52
Viscosity 125 cP
mmol 4.7 Vi/g
Appearance A: White / B: Light Amber
Cure 15 minutes / 150 °C
Durometer 75 Type D
Mix Ratio 100:1
Non-Volatile Content 100 %
Specific Gravity 1.1
Volume Resistivity 63,000,000,000,000 ohmcm
Comment 75 Type D with Dicumyl Peroxide Catalyst (Catalyst Not Included)
Display in metric units
 

The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.

NUSIL QUALITY SYSTEM (NQS™)


Developed in direct response to our work in the most challenging environments, NQS is a systematic approach to achieving consistent quality that goes far beyond what you'd expect.