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thermally conductive advancedengineering commercialaviation/defense/optoelectronics/electronics




50% M Fluoro. Recommended for short term exposure to solvents and fuel. (Contains Boron Nitride)


  • A two-part, thixotropic compound
  • 15:1 Mix Ratio (Part A:B)
  • Provides thermal conductivity when cured
  • Cures at room or temperature or rapidly with heat


  • Provides heat transfer between electrical/electronic components and heat sinks
  • For use as a sealant, adhesive or molding material requiring solvent resistance
  • Use to adhere covers on housings or where grooves or other configurations require a non-flowable material
  • For applications requiring an operating temperature range of -65°C to 225°C (-85°F to 437°F)

Product Details

Property Average result
Thermal Conductivity 1.25 W/(mK)
Cure System Platinum
Tensile 125 psi
Appearance A: White / B: Translucent
Cure 30 minutes / 150 °C
Durometer 50 Type A
Elongation 50 %
Mix Ratio 15:1
Specific Gravity 1.53
Work Time 90 minutes
Comment 50% M Fluoro. Recommended for short term exposure to solvents and fuel. (Contains Boron Nitride)
Display in metric units

The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.

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