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resins advancedengineering defense/electronics/optoelectronics/commercialaviation

CF2-4721

THERMOSETTING SILICONE RESIN

 

Description

  • A pre-catalyzed, solvent free, thermosetting resin
  • Forms a transparent rigid material when heat cured
  • Maintains cured properties and good electrical properties over a broad temperature range and in high humidity

Applications

  • Designed for impregnating electrical and electronic units in the nuclear power, aerospace and electronic industries
  • Provides excellent resistance to radiation

Product Details

Property Average result
Viscosity 130 cP
Durometer 75 Type D
Appearance Clear to light amber
Cure 15 minutes / 150 C
Cure System Peroxide
Non-Volatile Content 100 %
Refractive Index 1.52
Specific Gravity 1.09
Comment Hard Resin;Contains vinyl-specific peroxide in 1.52 RI resin. Requires heat to cure and oxygen inhibited. Not recommended for general encapsulation.
Display in metric units
 

The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.

NUSIL QUALITY SYSTEM (NQS™)


Developed in direct response to our work in the most challenging environments, NQS is a systematic approach to achieving consistent quality that goes far beyond what you'd expect.