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thermally conductive advancedengineering space

CV-2900

THERMALLY CONDUCTIVE CONTROLLED VOLATILITY SILICONE ADHESIVE

 

Description

  • One-Part, white RTV silicone
  • Non-slumping in thin sections
  • Non-corrosive
  • Designed for enhanced performance in extreme low and high temperatures

Applications

  • For applications requiring low outgassing and minimal volatile condensables under extreme operating conditions
  • To provide moderate heat transfer between electrical/electronic components and their heat sinks
  • As a sealing, caulking, adhesive or potting material in electronics and space applications requiring minimal outgassing to avoid condensation in sensitive devices
  • For bonding and sealing in applications such as overhead or vertical joints that require a non-slumping and one-part material
  • For applications requiring a broader operating temperature range

Meets or exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A and European Space Agency PSS-014-702, with a TML of ≤1% and CVCM of ≤0.1%


Product Details

Property Average result
Thermal Conductivity 0.61 W/(mK)
Extrusion Rate 40 g/minute
Cure System Oxime
Tensile 400 psi
Appearance White
Cte 223 ppm/C
Cure 72 hours / RTV
Durometer 65 Type A
Elongation 150 %
Ionic Content Cl <5 ppm
Ionic Content K <5 ppm
Ionic Content Na <5 ppm
Mix Ratio 1 PART
Specific Gravity 2.33
Tack Free Time 40 minutes
Comment *22) 0.6 W/mK, Low Temperature
Display in metric units
 

The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.

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