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thermally conductive advancedengineering space




*22) 1.0 W/mK, *4) Primed Lap Shear 375 psi (2.6 MPa)


  • Two-part, gray, thermally conductive silicone
  • Based on a dimethyl silicone polymer
  • Uses a platinum-catalyzed addition cure
  • 20:1 Mix Ratio (Part A:B)


  • For applications requiring low outgassing and minimal volatile condensables under extreme operating conditions to avoid condensation in sensitive devices
  • To provide moderate heat transfer between electrical/electronic components and their heat sinks
  • Use to adhere openings in modules or housings where grooves and other configurations require a non-flowable to limited flow material

Meets or exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A and European Space Agency PSS-014-702, with a TML of ≤1% and CVCM of ≤0.1%

Product Details

Property Average result
Thermal Conductivity 1 W/(mK)
Cure System Platinum
Tensile 650 psi
Appearance Gray
Cte 185 ppm/°C
Cure 24 hours / RTV
Dielectric Strength 430 volts/mil
Durometer 85 Type A
Elongation 15 %
Lap Shear 375 psi
Mix Ratio 20:1
Specific Gravity 2.4
Tack Free Time 4 hours
Tear 55 ppi
Volume Resistivity 140,000,000,000,000 ohmcm
Work Time 2.5 hours
Comment *22) 1.0 W/mK, *4) Primed Lap Shear 375 psi (2.6 MPa)
Display in metric units

The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.

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