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thermally conductive advancedengineering space




*22) 0.8 W/mK Low Viscosity, *3) Primed Lap Shear 205 psi (1.4 MPa), Low Temp


  • Two-part, white, thermally conductive silicone
  • Cures with the addition of heat
  • Mix Ratio 10:1 (Part A:B)
  • Designed for enhanced performance in extreme low and high temperatures


  • For applications requiring low outgassing and minimal volatile condensables under extreme operating conditions to avoid condensation in sensitive devices
  • To provide moderate heat transfer between electrical/electronic components and their heat sinks
  • Use for adhering openings in modules and housings where grooves or other configurations require a limited flow material
  • For applications requiring a broader operating temperature range

Meets or exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A and European Space Agency PSS-014-702, with a TML of ≤1% and CVCM of ≤0.1%

Product Details

Property Average result
Thermal Conductivity 0.79 W/(mK)
Viscosity 300,000 cP
Cure System Platinum
Tensile 275 psi
Appearance White
Cte 275 ppm/°C
Cure 30 minutes / 150 °C
Durometer 75 Type A
Elongation 40 %
Lap Shear 205 psi
Mix Ratio 10:1
Specific Gravity 1.38
Tack Free Time 3.5 hours
Tear 45 ppi
Work Time 2 hours
Comment *22) 0.8 W/mK Low Viscosity, *3) Primed Lap Shear 205 psi (1.4 MPa), Low Temp
Display in metric units

The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.

What Is Space Grade?

Discover what it takes to make silicones worthy of the distinction "Space Grade" and the rigorous testing that these materials undergo.

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