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thermally conductive advancedengineering space





  • Two-part, white, thermally conductive silicone
  • Cures with the addition of heat
  • Mix Ratio 10:1 (Part A:B)
  • Designed for enhanced performance in extreme low and high temperatures


  • For applications requiring low outgassing and minimal volatile condensables under extreme operating conditions to avoid condensation in sensitive devices
  • To provide moderate heat transfer between electrical/electronic components and their heat sinks
  • Use for adhering openings in modules and housings where grooves or other configurations require a limited flow material
  • For applications requiring a broader operating temperature range

Meets or exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A and European Space Agency PSS-014-702, with a TML of ≤1% and CVCM of ≤0.1%

Product Details

Property Average result
Tensile 275 psi
Cure System Platinum
Viscosity 300,000 cP
Thermal Conductivity 0.79 W/(mK)
Appearance White
Cte 275 ppm/C
Cure 30 minutes / 150 C
Durometer 75 Type A
Elongation 40 %
Lap Shear 205 psi
Mix Ratio 10:1
Specific Gravity 1.38
Tack Free Time 3.5 hours
Tear 45 ppi
Work Time 2 hours
Comment *22) 0.8 W/mK Low Viscosity, *3) Primed Lap Shear 205 psi (1.4 MPa), Low Temp
Display in metric units

The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.


Developed in direct response to our work in the most challenging environments, NQS is a systematic approach to achieving consistent quality that goes far beyond what you'd expect.