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thermally conductive
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Description
- Two-part, white, thermally conductive silicone
- Will cure with the addition of heat
- 10: 1 Mix Ratio (Part A: Part B)
Applications
- For applications requiring low outgassing and minimal volatile condensables under extreme operating conditions
- To provide heat transfer between electrical/electronic components and their heat sinks
- Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a flowable to limited flow material
Meets or exceeds the ASTM E 595 low outgas specifications outlined
in NASA SP-R-0022A and European Space Agency PSS-014-702, with
a TML of ≤1% and CVCM of ≤0.1%
| Property |
Average result |
| Tensile |
250 psi
|
| Cure System |
Platinum |
| Viscosity |
900,000 cP
|
| Thermal Conductivity |
1.11 W/(mK)
|
| Appearance |
White |
| Cure |
4 hours / 65 C |
| Durometer |
75 Type A
|
| Elongation |
60 %
|
| Mix Ratio |
10:1 |
| Specific Gravity |
1.45 |
| Tack Free Time |
4 hours
|
| Tear |
55 ppi
|
| Work Time |
2 hours
|
| Comment |
*22) 1.1 W/mK |
| Property |
Average result |
| Tensile |
1.72 MPa
|
| Cure System |
Platinum |
| Viscosity |
900,000 MPa*s
|
| Thermal Conductivity |
1.11 W/(mK)
|
| Appearance |
White |
| Cure |
4 hours / 65 C |
| Durometer |
75 Type A
|
| Elongation |
60 %
|
| Mix Ratio |
10:1 |
| Specific Gravity |
1.45 |
| Tack Free Time |
4 hours
|
| Tear |
9.7 kN/m
|
| Work Time |
2 hours
|
| Comment |
*22) 1.1 W/mK |
Display in metric units
The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.
NUSIL QUALITY SYSTEM (NQS™)
Developed in direct response to our work in the most challenging environments, NQS is a systematic approach to achieving consistent quality that goes far beyond what you'd expect.