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thermally conductive advancedengineering space




*22) 1.1 W/mK


  • Two-part, white, thermally conductive silicone
  • Will cure with the addition of heat
  • 10: 1 Mix Ratio (Part A: Part B)


  • For applications requiring low outgassing and minimal volatile condensables under extreme operating conditions
  • To provide heat transfer between electrical/electronic components and their heat sinks
  • Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a flowable to limited flow material

Meets or exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A and European Space Agency PSS-014-702, with a TML of ≤1% and CVCM of ≤0.1%

Product Details

Property Average result
Thermal Conductivity 1.11 W/(mK)
Viscosity 900,000 cP
Cure System Platinum
Tensile 250 psi
Appearance White
Cure 4 hours / 65 °C
Durometer 75 Type A
Elongation 60 %
Mix Ratio 10:1
Specific Gravity 1.45
Tack Free Time 4 hours
Tear 55 ppi
Work Time 2 hours
Comment *22) 1.1 W/mK
Display in metric units

The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.

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