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thermally conductive advancedengineering space





  • Two-part, white, thermally conductive, low viscosity silicone
  • elastomer
  • Cures with the addition of heat
  • 1:1 Mix Ratio (Part A: Part B)


  • For applications requiring low outgassing and minimal volatile
  • condensables under extreme operating conditions
  • To provide heat transfer between electrical/electronic
  • components and their heat sinks
  • Use to adhere integrated circuit substrates, base plates, heat
  • sinks or where grooves or other configurations require a limited
  • flow material

Meets or exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A and European Space Agency PSS-014-702, with a TML of ≤1% and CVCM of ≤0.1%

Product Details

Property Average result
Thermal Conductivity 0.95 W/(mK)
Viscosity 50,000 cP
Cure System Platinum
Tensile 180 psi
Appearance White
Cure 15 minutes / 150 C
Durometer 65 Type A
Elongation 50 %
Lap Shear 120 psi
Mix Ratio 1:1
Specific Gravity 2.34
Tack Free Time 13 hours
Comment *22) 1.0 W /mK, *5) Primed Lap Shear 120 psi (0.8 MPa)
Display in metric units

The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.


Developed in direct response to our work in the most challenging environments, NQS is a systematic approach to achieving consistent quality that goes far beyond what you'd expect.