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thermally conductive advancedengineering space

CV2-2946

THERMALLY CONDUCTIVE, CONTROLLED VOLATILITY SILICONE

 

Description

  • Two-part, white, thermally conductive silicone
  • Cures with the addition of heat
  • Designed to allow bond line thicknesses  50 microns
  • 20:1 Mix Ratio (Part A:Part B)

Applications

  • For applications requiring low outgassing and minimal volatile condensables under extreme operating conditions to avoid condensation in sensitive devices
  • To provide heat transfer between electrical/electronic components and their heat sinks
  • Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a non-flowable to limited flow material

Meets or exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A and European Space Agency PSS-014-702, with a TML of ≤1% and CVCM of ≤0.1%


Product Details

Property Average result
Tensile 400 psi
Cure System Platinum
Extrusion Rate 140 g/minute
Thermal Conductivity 0.64 W/(mK)
Appearance White
Cure 30 minutes / 150 C
Durometer 55 Type A
Elongation 225 %
Mix Ratio 20:1
Tear 55 ppi
Work Time 3 hours
Comment *22) 0.6 W/mK, Thin Bond Line
Display in metric units
 

The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.

What Is Space Grade?

Discover what it takes to make silicones worthy of the distinction "Space Grade" and the rigorous testing that these materials undergo.

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