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thermally conductive advancedengineering space




Low outgassing, thermally conductive gel used for thermal management


  • Two-part, white, thermally conductive silicone gel
  • Cures with the addition of heat
  • 20:1 Mix Ratio (Part A:B)


  • For applications requiring low outgassing and minimal volatile condensables under extreme operating conditions to avoid condensation in sensitive devices
  • To provide heat transfer between electrical/electronic components and their heat sinks
  • Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a non-flowable to limited flow material

Meets or exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A and European Space Agency PSS-014-702, with a TML of ≤1% and CVCM of ≤0.1%

Product Details

Property Average result
Thermal Conductivity 0.95 W/(mK)
Extrusion Rate 122 g/minute
Cure System Platinum
Appearance White
Cure 72 hours / 25 °C
Durometer 36 Type 00
Lap Shear 27 psi
Specific Gravity 1.3
Tack Free Time 16.5 hours
Volatile Content 0.01 %
Work Time 5.5 hours
Comment Gel, soft and compliant
Display in metric units

The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.

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