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thermally conductive advancedengineering space

CV4-2946

THERMALLY CONDUCTIVE, CONTROLLED VOLATILITY SILICONE

 

Low outgassing, thermally conductive gel used for thermal management

Description

  • Two-part, white, thermally conductive silicone gel
  • Cures with the addition of heat
  • 20:1 Mix Ratio (Part A:B)

Applications

  • For applications requiring low outgassing and minimal volatile condensables under extreme operating conditions to avoid condensation in sensitive devices
  • To provide heat transfer between electrical/electronic components and their heat sinks
  • Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a non-flowable to limited flow material

Meets or exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A and European Space Agency PSS-014-702, with a TML of ≤1% and CVCM of ≤0.1%


Product Details

Property Average result
Cure System Platinum
Extrusion Rate 122 g/minute
Thermal Conductivity 0.95 W/(mK)
Appearance White
Cure 72 hours / 25 °C
Durometer 36 Type 00
Lap Shear 27 psi
Specific Gravity 1.3
Tack Free Time 16.5 hours
Volatile Content 0.01 %
Work Time 5.5 hours
Comment Gel, soft and compliant
Display in metric units
 

The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.

What Is Space Grade?

Discover what it takes to make silicones worthy of the distinction "Space Grade" and the rigorous testing that these materials undergo.

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