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gels advancedengineering electronics/optoelectronics

EPM-2482

LOW VOLATILITY DIELECTRIC SILICONE GEL

 

Description

  • Two-part, clear silicone gel
  • Designed for enhanced performance in extreme low and high temperatures
  • 1:1 Mix Ratio (Part A: Part B)

Applications

  • For applications requiring low volatility
  • Useful for potting intricate assemblies due to a low viscosity
  • As a low modulus embedding or potting compound for environmental protection of electronic assemblies and components

Product Details

Property Average result
Penetration 3 mm
Viscosity 1,800 cP
Mix Ratio 1:1
Appearance Transparent
Cure 40 minutes / 150 C
Cure System Platinum
Ionic Content Cl <5 ppm
Ionic Content K <1 ppm
Ionic Content Na <4 ppm
Volatile Content 0.3 %
Comment Soft High Tack Gel;For applications requiring low volatility. Useful for potting intricate assemblies due to a low viscosity. As a low modulus embedding or potting compound for environmental protection of electronic assemblies and components
Display in metric units
 

The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.

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