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thermally conductive advancedengineering electronics/optoelectronics

EPM-2490

LOW VOLATILITY THERMALLY CONDUCTIVE SILICONE ADHESIVE

 

Description

  • Two-part, white, thermally conductive, electrically insulating, silicone system
  • Electrically insulative and non-corrosive
  • 15:1 Mix Ratio (Part A: Part B)

Applications

  • Flexible Thermal interface material (TIM) designed to provide heat transfer between electrical/electronic components and their heat sinks for a variety of component level packaging
  • For applications requiring a broad operating temperature range
  • Ideal where a form-in-place TIM is needed for use as a sealing, caulking, adhesive, or potting material in electronics applications requiring minimal volatility for prevention of contamination in sensitive devices

Product Details

Property Average result
Tensile 200 psi
Cure System Platinum
Viscosity 3,672,800 cP
Thermal Conductivity 1.49 W/(mK)
Appearance White
Durometer 75 Type A
Elongation 30 %
Flow Rate 0.3 in
Ionic Content Cl <3 ppm
Ionic Content K <3 ppm
Ionic Content Na <6 ppm
Lap Shear 160 psi
Mix Ratio 15:1
Specific Gravity 1.53
Tack Free Time 4.5 hours
Tear 50 ppi
Work Time 2 hours
Comment 1.5 W/mK, 160 psi lap shear primed w/CF1-135, 2 hr. pot life. (Contains Boron Nitride)
Display in metric units
 

The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.

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