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thermally conductive advancedengineering electronics/optoelectronics

EPM-2490

LOW VOLATILITY THERMALLY CONDUCTIVE SILICONE ADHESIVE

 

Description

  • Two-part, white, thermally conductive, electrically insulating, silicone system
  • Electrically insulative and non-corrosive
  • 15:1 Mix Ratio (Part A: Part B)

Applications

  • Flexible Thermal interface material (TIM) designed to provide heat transfer between electrical/electronic components and their heat sinks for a variety of component level packaging
  • For applications requiring a broad operating temperature range
  • Ideal where a form-in-place TIM is needed for use as a sealing, caulking, adhesive, or potting material in electronics applications requiring minimal volatility for prevention of contamination in sensitive devices

Product Details

Property Average result
Thermal Conductivity 1.49 W/(mK)
Viscosity 3,672,800 cP
Cure System Platinum
Tensile 200 psi
Appearance White
Durometer 75 Type A
Elongation 30 %
Flow Rate 0.3 in
Ionic Content Cl <3 ppm
Ionic Content K <3 ppm
Ionic Content Na <6 ppm
Lap Shear 160 psi
Mix Ratio 15:1
Specific Gravity 1.53
Tack Free Time 4.5 hours
Tear 50 ppi
Work Time 2 hours
Comment 1.5 W/mK, 160 psi lap shear primed w/CF1-135, 2 hr. pot life. (Contains Boron Nitride)
Display in metric units
 

The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.

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