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thermally conductive advancedengineering optoelectronics/electronics




Recommended for bondlines 50 micron or greater. (Contains Boron Nitride)


  • Two-part, white, thermally conductive silicone
  • Cures with the addition of heat
  • Designed to allow bond line thicknesses  50 micron to reduce thermal resistance
  • 20:1 Mix Ratio (Part A: Part B)


  • For applications requiring low volatility under extreme operating conditions to avoid contamination in sensitive devices
  • To provide heat transfer between electrical/electronic components and their heat sinks while remaining electrically insulating
  • Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a non-flowable to limited flow material

Product Details

Property Average result
Thermal Conductivity 0.64 W/(mK)
Extrusion Rate 140 g/minute
Cure System Platinum
Tensile 400 psi
Appearance White
Cure 30 minutes / 150 °C
Durometer 55 Type A
Elongation 225 %
Ionic Content Cl <6 ppm
Ionic Content K <3 ppm
Ionic Content Na <3 ppm
Mix Ratio 20:1
Tear 55 ppi
Work Time 3 hours
Comment Recommended for bondlines 50 micron or greater. (Contains Boron Nitride)
Display in metric units

The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.

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