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thermally conductive advancedengineering electronics/optoelectronics

EPM-2496

LOW VOLATILITY THERMALLY CONDUCTIVE SILICONE POTTING ELASTOMER

 

Description

  • Two part, Gray, 1:1 Mix ratio (A:B)
  • Pourable and self-leveling
  • Cures at room temperature
  • REACh and RoHS compliant

Applications

  • For applications requiring low volatility under extreme operating conditions to avoid contamination in sensitive devices
  • Eliminates need for extra heating steps for removing volatiles after cured in device
  • Quick set-up and fast ambient cure schedule
  • Enhanced thermal conductivity for removal of heat and improved reliability
  • Low viscosity allows the potting of complex geometries without the entrapment of air
  • Applications include: potting for sensors, relays, and other electronic components requiring protection from vibration and generally harsh environmental conditions

Product Details

Property Average result
Tensile 700 psi
Viscosity A: 5,000 cP / B: 3,500 cP
Thermal Conductivity 0.5 W/(mK)
Appearance Gray
Cure 10 minutes / 150 °C
Durometer 65 Type A
Elongation 115 %
Specific Gravity 1.5
Volatile Content 0.5 %
Work Time 25 minutes
Display in metric units
 

The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.

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