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thermally conductive advancedengineering electronics/optoelectronics




Excellent for bonding in thin layers and does not contain Boron Nitride.


  • One-Part, white RTV silicone
  • Non-slumping in thin sections


  • To provide moderate heat transfer between electrical/electronic components and their heat sinks
  • As a sealing, caulking, adhesive or potting material in electronics applications requiring minimal outgassing to avoid condensation in sensitive devices
  • Use for any application where grooves and other configurations require a non-slumping, non-flowable to limited flow one-part material
  • For applications requiring a broader operating temperature range

Product Details

Property Average result
Thermal Conductivity 0.61 W/(mK)
Extrusion Rate 40 g/minute
Cure System Oxime
Tensile 400 psi
Appearance White
Cte 221 ppm/°C
Cure 72 hours / RTV
Durometer 65 Type A
Elongation 150 %
Ionic Content Cl <5 ppm
Ionic Content K <5 ppm
Ionic Content Na <5 ppm
Lap Shear 225 psi
Mix Ratio 1 PART
Specific Gravity 2.33
Tack Free Time 40 minutes
Tear 55 ppi
Comment Excellent for bonding in thin layers and does not contain Boron Nitride.
Display in metric units

The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.

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