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thermally conductive advancedengineering electronics/optoelectronics




Recommended for bondlines 5 micron or greater.


  • Two-part, white, thermally conductive, low viscosity silicone
  • elastomer
  • Cures with the addition of heat
  • 1:1 Mix Ratio (Part A: Part B)


  • For applications requiring a low volatility, conformal, thermally
  • conductive silicone.
  • To provide heat transfer between electrical/electronic
  • components and their heat sinks
  • Use to adhere integrated circuit substrates, base plates, heat
  • sinks or where grooves or other configurations require a limited
  • flow material

Product Details

Property Average result
Thermal Conductivity 0.95 W/(mK)
Viscosity 36,000 cP
Cure System Platinum
Tensile 180 psi
Appearance White
Cure 14 minutes / 150 °C
Dielectric Strength 465 volts/mil
Durometer 65 Type A
Elongation 50 %
Ionic Content Cl <5 ppm
Ionic Content K <3 ppm
Ionic Content Na <5 ppm
Lap Shear 120 psi
Mix Ratio 1:1
Specific Gravity 2.34
Tack Free Time 13 hours
Volatile Content 0.35 %
Volume Resistivity 34,000,000,000,000 ohmcm
Comment Recommended for bondlines 5 micron or greater.
Display in metric units

The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.

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