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gels advancedengineering electronics/optoelectronics

LS-3238

ENCAPSULATION GEL

 

Description

  • A two-part, encapsulation gel
  • Extended work time
  • 1:1 Mix Ratio (Part A:B)

Applications

  • For protection of sensitive photonics assemblies from mechanical shock, thermal shock, dust, and ambient atmosphere
  • Extended work time allows voids in complex assemblies to fill in and permits time for any trapped air bubbles to float to the fluid surface and escape
  • For applications requiring an operating temperature range of -40°C to 200°C (-40°F to 392°F) or for soldering operations up to 260°C (500°F) for 1 to 2 minutes

Product Details

Property Average result
Mix Ratio 1:1
Viscosity 1,500 cP
Durometer 15 Type 00
Appearance Clear
Cure 30 minutes / 150 C
Cure System Platinum
Operating Temperature -40 C / 200 C
Refractive Index 1.38
Specific Gravity 1.28
Volatile Content 0.14 %
Work Time 11 hours
Comment Resistant to hydrocarbon solvents. Index matches Magnesium Fluoride. Potlife based on 3,000 cPs maximum mixed viscosity after 6hrs
Display in metric units
 

The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.

NUSIL QUALITY SYSTEM (NQS™)


Developed in direct response to our work in the most challenging environments, NQS is a systematic approach to achieving consistent quality that goes far beyond what you'd expect.