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thermally conductive advancedengineering electronics/optoelectronics

R-2165

THERMALLY CONDUCTIVE SILICONE POTTING ELASTOMER

 

Description

  • Two part, Gray, 1:1 Mix ratio (A:B)
  • Pourable and self-leveling
  • Cures at room temperature
  • REACh and RoHS compliant

Applications

  • Enhanced thermal conductivity for removal of heat and improved reliability
  • Low viscosity allows the potting of complex geometries without the entrapment of air
  • Quick set-up and flexible cure schedule
  • Applications include: potting for sensors, relays, and other electronic components requiring protection from vibration and generally harsh environmental conditions

Product Details

Property Average result
Thermal Conductivity 0.6 W/(mK)
Viscosity 4,400 cP
Cure System Platinum
Tensile 500 psi
Appearance Gray
Cte 230 ppm/C
Cure 10 minutes / 150 C
Dielectric Strength 700 volts/mil
Durometer 60 Type A
Elongation 100 %
Mix Ratio 1:1
Specific Gravity 1.54
Tear 30 ppi
Volume Resistivity 1,000,000,000,000,000 ohmcm
Work Time 10 minutes
Comment 0.6 W/mK, versatile, moderate thermally conductive silicone. Will RTV.
Display in metric units
 

The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.

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