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thermally conductive advancedengineering electronics/optoelectronics

R-2165

THERMALLY CONDUCTIVE SILICONE POTTING ELASTOMER

 

Description

  • Two part, Gray, 1:1 Mix ratio (A:B)
  • Pourable and self-leveling
  • Cures at room temperature
  • REACh and RoHS compliant

Applications

  • Enhanced thermal conductivity for removal of heat and improved reliability
  • Low viscosity allows the potting of complex geometries without the entrapment of air
  • Quick set-up and flexible cure schedule
  • Applications include: potting for sensors, relays, and other electronic components requiring protection from vibration and generally harsh environmental conditions

Product Details

Property Average result
Tensile 500 psi
Cure System Platinum
Viscosity 4,400 cP
Thermal Conductivity 0.6 W/(mK)
Appearance Gray
Cte 230 ppm/C
Cure 10 minutes / 150 C
Dielectric Strength 700 volts/mil
Durometer 60 Type A
Elongation 100 %
Mix Ratio 1:1
Specific Gravity 1.54
Tear 30 ppi
Volume Resistivity 1,000,000,000,000,000 ohmcm
Work Time 10 minutes
Comment 0.6 W/mK, versatile, moderate thermally conductive silicone. Will RTV.
Display in metric units
 

The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.

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