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thermally conductive advancedengineering electronics/optoelectronics




0.4 W/mk, pourable, heat resistant, tested per UL94 and passed V0. Will RTV.


  • Two part, Black, 1:1 Mix ratio (A:B)
  • Pourable and self-leveling
  • Cures at room temperature
  • REACh and RoHS compliant
  • Tested per UL-94 and passed V-0


  • Thermally stable, flowable material that cures at room temperature
  • Low viscosity allows the potting of complex geometries without the entrapment of air
  • Applications include: potting for connectors, sensors, relays, power devices and other electronic components requiring protection from vibration and generally harsh environmental conditions

Product Details

Property Average result
Thermal Conductivity 0.4 W/(mK)
Viscosity A: 2,700 cP / B: 1,500 cP
Cure System Platinum
Tensile 525 psi
Appearance Black
Cte 142 ppm/°C / 247 ppm/°C
Cure 60 minutes / 150 °C
Dielectric Strength 580 volts/mil
Durometer 50 Type A
Elongation 130 %
Mix Ratio 1:1
Volume Resistivity 43,000,000,000,000 ohmcm
Work Time 1 hours
Comment 0.4 W/mk, pourable, heat resistant, tested per UL94 and passed V0. Will RTV.
Display in metric units

The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.

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