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thermally conductive advancedengineering electronics/optoelectronics





  • Two part, Black, 1:1 Mix ratio (A:B)
  • Pourable and self-leveling
  • Cures at room temperature
  • REACh and RoHS compliant
  • Tested per UL-94 and passed V-0


  • Thermally stable, flowable material that cures at room temperature
  • Low viscosity allows the potting of complex geometries without the entrapment of air
  • Applications include: potting for connectors, sensors, relays, power devices and other electronic components requiring protection from vibration and generally harsh environmental conditions

Product Details

Property Average result
Tensile 525 psi
Cure System Platinum
Viscosity A: 2,700 cP / B: 1,500 cP
Thermal Conductivity 0.4 W/(mK)
Appearance Black
Cte 142 ppm/°C / 247 ppm/°C
Cure 60 minutes / 150 °C
Dielectric Strength 580 volts/mil
Durometer 50 Type A
Elongation 130 %
Mix Ratio 1:1
Volume Resistivity 43,000,000,000,000 ohmcm
Work Time 1 hours
Comment 0.4 W/mk, pourable, heat resistant, tested per UL94 and passed V0. Will RTV.
Display in metric units

The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.

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