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thermally conductive advancedengineering electronics/optoelectronics/commercialaviation/defense




Smooth Paste;1.45 W/mK, 3 hr. pot life. (Contains Boron Nitride)


  • Two-part, white, thermally conductive silicone
  • Cure may be heat accelerated
  • 15:1 Mix Ratio (Part A: Part B)


  • To provide heat transfer between electrical/electronic components and their heat sinks
  • Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a non-flowable to limited flow material

Product Details

Property Average result
Thermal Conductivity 1.46 W/(mK)
Cure System Platinum
Tensile 260 psi
Appearance White
Cure 30 minutes / 150 °C
Dielectric Strength 880 volts/mil
Durometer 80 Type A
Elongation 20 %
Flow Rate 0.3 in
Mix Ratio 15:1
Operating Temperature -65 °C / 240 °C
Specific Gravity 1.55
Work Time 3 hours
Comment Smooth Paste;1.45 W/mK, 3 hr. pot life. (Contains Boron Nitride)
Display in metric units

The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.

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