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thermally conductive advancedengineering commercialaviation/defense/electronics/optoelectronics

R-2930

THERMALLY CONDUCTIVE SILICONE

 

Description

  • Two-part, white, thermally conductive silicone
  • Cure may be heat accelerated
  • 15:1 Mix Ratio (Part A: Part B)

Applications

  • To provide heat transfer between electrical/electronic components and their heat sinks
  • Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a non-flowable to limited flow material

Product Details

Property Average result
Tensile 260 psi
Cure System Platinum
Thermal Conductivity 1.46 W/(mK)
Appearance White
Cure 30 minutes / 150 C
Dielectric Strength 880 volts/mil
Durometer 80 Type A
Elongation 20 %
Flow Rate 0.3 inches
Mix Ratio 15:1
Operating Temperature -65 C / 240 C
Specific Gravity 1.55
Work Time 3 hours
Comment Smooth Paste;1.45 W/mK, 3 hr. pot life. (Contains Boron Nitride)
Display in metric units
 

The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.

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