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thermally conductive advancedengineering commercialaviation/optoelectronics/defense/electronics

R-2939

LOW VISCOSITY, THERMALLY CONDUCTIVE SILICONE

 

Description

  • Two-part, white, thermally conductive, pourable silicone
  • Cure may be heat accelerated
  • 15:1 Mix Ratio (Part A:Part B)

Applications

  • To provide heat transfer between electrical/electronic components and their heat sinks
  • Use to adhere openings in modules and housings where grooves or other configurations require a limited flow material with moderate thermal conductivity

Product Details

Property Average result
Thermal Conductivity 0.75 W/(mK)
Viscosity 70,000 cP
Cure System Platinum
Tensile 300 psi
Appearance White
Cure 30 minutes / 150 C
Dielectric Strength 810 volts/mil
Durometer 70 Type A
Elongation 70 %
Mix Ratio 15:1
Specific Gravity 1.34
Tear 45 ppi
Work Time 4 hours
Comment 0.75 W/mK, 4 hr. pot life. (Contains Boron Nitride)
Display in metric units
 

The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.

Mass Customization

Whether you require boutique creations or mass-market offerings, the NuSil™ brand is committed to creating your products, your way. See how we've honed our processes and proprietary equipment to deliver customization at a mass scale.

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