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thermally conductive advancedengineering commercialaviation/defense/electronics/optoelectronics




Smooth Paste;0.8 W/mK, 5 hr. pot life.


  • Two-part, gray, thermally conductive silicone with high strength
  • Cure may be heat accelerated
  • 20:1 Mix Ratio
  • (Part A:Part B)


  • To provide heat transfer between electrical/electronic components and their heat sinks
  • Use to adhere integrated circuit substrates, base plates and heat sinks or where grooves or other configurations require a non-flowable to limited flow material

Product Details

Property Average result
Thermal Conductivity 0.84 W/(mK)
Cure System Platinum
Tensile 700 psi
Appearance Gray
Cure 30 minutes / 150 °C
Dielectric Strength 450 volts/mil
Durometer 90 Type A
Elongation 35 %
Mix Ratio 20:1
Specific Gravity 2.41
Tack Free Time 24 hours
Tear 65 ppi
Work Time 5 hours
Comment Smooth Paste;0.8 W/mK, 5 hr. pot life.
Display in metric units

The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.

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