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thermally conductive advancedengineering commercialaviation/defense/electronics/optoelectronics

R-2949

THERMALLY CONDUCTIVE SILICONE

 

Description

  • Two-part, white, thermally conductive silicone
  • Cure may be heat accelerated
  • 15:1 Mix Ratio (Part A:Part B)

Applications

  • To provide heat transfer between electrical/electronic components and their heat sinks
  • For use in extreme low temperature applications
  • Use for adhering openings in modules and housing where grooves or other configurations require a limited flow material with moderate thermal conductivity

Product Details

Property Average result
Tensile 275 psi
Cure System Platinum
Viscosity 75,000 cP
Thermal Conductivity 0.75 W/(mK)
Appearance White
Cure 30 minutes / 150 C
Dielectric Strength 920 volts/mil
Durometer 75 Type A
Elongation 50 %
Mix Ratio 15:1
Specific Gravity 1.37
Tear 45 ppi
Work Time 3.5 hours
Comment For applications requiring a broader operating temperature range. (Contains Boron Nitride)
Display in metric units
 

The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.

Mass Customization

Whether you require boutique creations or mass-market offerings, the NuSil™ brand is committed to creating your products, your way. See how we've honed our processes and proprietary equipment to deliver customization at a mass scale.

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