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adhesives/sealants advancedengineering electronics/optoelectronics





  • Two-part, translucent, thixotropic, high tear strength silicone system
  • Cures rapidly with the application of heat in an oven, or by a heat gun or lamp
  • Many bonding applications do not require the use of a silicone primer for suitable adhesion
  • Does not require atmospheric moisture to cure
  • No curing byproducts such as acetic acid or methyl alcohol
  • Consistency allows product to be supplied in easy-to-use, airless side-by-side kits that eliminate mixing and deairing difficulties
  • 1:1 Mix ratio (Part A:Part B)


  • Adhesive for bonding and sealing silicones to each other and other substrates such as metals and plastics
  • For rapid production or prototyping due to a rapid cure

Product Details

Property Average result
Cure System Platinum
Viscosity 170,000 cP
Extrusion Rate 15 g/minute
Lap Shear 150 psi
Durometer 15 Type A
Appearance Translucent
Cure 15 minutes / 150 C
Dielectric Strength 905 volts/mil
Elongation 850 %
Flow Rate 0.5 inches
Mix Ratio 1:1
Specific Gravity 1.12
Stress @ Strain 35 psi / 100 %
Tear 125 ppi
Tensile 975 psi
Work Time 15 hours
Comment Primerless Adhesive;Heat Cure. Flow 0.5 per 5 minutes. Requires heat to cure. 150 psi (1.0 MPa), unprimed lap shear.
Display in metric units

The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.

Advanced Engineering

The diverse line of NuSil™ adhesives specifically designed for electronic component assembly increases production throughput without sacrificing performance.

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