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adhesives/sealants
advancedengineering
space
Description
- Two-part, red, low specific gravity, RTV silicone
- 1:1 Mix Ratio (Part A: Part B)
Applications
- For applications requiring Ultra Low OutgassingTM and minimal volatile condensables under extreme operating conditions to avoid condensation in sensitive devices
- Use a bonding, sealing, or potting material in electronic and space applications
- Provides radiation resistance, low thermal conductivity, oxidation stability, thermal stability and good ablative characteristics
- Especially useful to bond solar cells to solar array panels
- For applications requiring a broader operating temperature range
Exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A and European Space Agency PSS-014-702, with a maximum TML of 0.1% and CVCM of less than 0.010%
| Property |
Average result |
| Cure System |
Platinum |
| Viscosity |
325,000 cP
|
| Lap Shear |
175 psi
|
| Durometer |
45 Type A
|
| Appearance |
A: Red / B: White |
| Cure |
30 minutes / 150 C |
| Elongation |
150 %
|
| Mix Ratio |
1:1 |
| Special Feature |
Ultra Low Outgassing |
| Specific Gravity |
0.74 |
| Tensile |
225 psi
|
| Work Time |
4 hours
|
| Comment |
Fast Cure, Low Density, Primed Lap Shear 175psi |
| Property |
Average result |
| Cure System |
Platinum |
| Viscosity |
325,000 MPa*s
|
| Lap Shear |
1.21 MPa
|
| Durometer |
45 Type A
|
| Appearance |
A: Red / B: White |
| Cure |
30 minutes / 150 C |
| Elongation |
150 %
|
| Mix Ratio |
1:1 |
| Special Feature |
Ultra Low Outgassing |
| Specific Gravity |
0.74 |
| Tensile |
1.55 MPa
|
| Work Time |
4 hours
|
| Comment |
Fast Cure, Low Density, Primed Lap Shear 175psi |
Display in metric units
The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.
What Is Space Grade?
Discover what it takes to make silicones worthy of the distinction "Space Grade" and the rigorous testing that these materials undergo.
Read More