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thermally conductive advancedengineering electronics/optoelectronics/space

SCV1-2599

ULTRA LOW OUTGASSINGTM THERMALLY CONDUCTIVE SILICONE

 

Description

  • Two-part, white, thermally conductive silicone
  • Cures with the addition of heat
  • 15:1 Mix Ratio (Part A:B)

Applications

  • For applications requiring Ultra Low OutgassingTM and minimal volatile condensables under extreme operating conditions to avoid condensation in sensitive devices
  • To provide heat transfer between electrical/electronic components and their heat sinks
  • Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a non- flowable to limited flow material

Exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A and European Space Agency PSS-014-702, with a TML of ≤0.1% and CVCM of ≤0.010%


Product Details

Property Average result
Tensile 200 psi
Cure System Platinum
Viscosity 3,750,000 cP
Thermal Conductivity 1.6 W/(mK)
Appearance White
Cte 165 ppm/C
Cure 7 days / RTV
Dielectric Strength 540 volts/mil
Durometer 75 Type A
Elongation 30 %
Lap Shear 150 psi
Mix Ratio 15:1
Specific Gravity 1.53
Tear 50 ppi
Volume Resistivity 530,000,000,000,000 ohmcm
Work Time 2 hours
Comment Primed w/CF1-135, Contains Boron Nitride
Display in metric units
 

The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.

What Is Space Grade?

Discover what it takes to make silicones worthy of the distinction "Space Grade" and the rigorous testing that these materials undergo.

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