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thermally conductive advancedengineering space

SCV2-2599

ULTRA LOW OUTGASSING™, THIXOTROPIC, THERMALLY CONDUCTIVE SILICONE

 

Description

  • Two-part, white, thermally conductive silicone
  • Cures with the addition of heat
  • Designed to allow bond line thicknesses  50 microns
  • 20:1 Mix Ratio (Part A:Part B)

Applications

  • For applications highly sensitive to outgas related contamination
  • To provide heat transfer between electrical/electronic components and their heat sinks
  • Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a non-flowable to limited flow material

Exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A and European Space Agency PSS-014-702, with a TML of ≤0.1% and CVCM of ≤0.010%


Product Details

Property Average result
Tensile 400 psi
Cure System Platinum
Extrusion Rate 140 g/minute
Thermal Conductivity 0.64 W/(mK)
Appearance White
Cure 30 minutes / 150 C
Durometer 55 Type A
Elongation 225 %
Mix Ratio 20:1
Special Feature Ultra Low Outgassing
Tear 55 ppi
Work Time 3 hours
Comment 0.64 W /mK (Tested per ASTM E1530)
Display in metric units
 

The above properties are tested on a lot-to-lot basis. Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations in establishing particular specifications.

What Is Space Grade?

Discover what it takes to make silicones worthy of the distinction "Space Grade" and the rigorous testing that these materials undergo.

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