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News & Resources

New Low Stress Film Adhesive for Aerospace Applications Requiring Low Outgassing

Low stress liquid adhesives based on silicone chemistry have been used for years in the aerospace industry requiring low outgas, ASTM E-595 requirements (1). The applications include coverglass adhesives, mirror bonding, potting of electronic parts and many more. Silicones are valued for their dependability during extreme temperature cycling and inherently low modulus characteristics. Aerospace Engineers working on applications that require precision bond lines for adhesion or sealing applications have struggled with liquid silicone systems. The lack of uniform bond thickness and mess/ clean-up issues result in significant process inefficiencies. Film adhesive technology solves many of these problems. Films can be produced to an exact thickness specified by the customer. If many of the same components are going to be adhered to, a die cut of the film could be obtained and reproduced to improve the efficiency of applying adhesive. Mess and clean-up are non-existent. The problem until recently is that low stress, low outgassing silicone film adhesive versions were not available. This paper will characterize new film adhesives and compare with similar liquid materials; CTE, High/low temperature resistance, adhesion, etc. The possibility for future novel applications will also be discussed.