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News & Resources

Versatility and Flexibility from Low Outgassing Silicones

Miniaturization of electronic packages has led to using thinner and more fragile materials. This, in combination with the use of lead-free solder with solder reflow temperatures up to 260°C, can cause high shear stress during heating and cooling that can damage a device. Subsequently, there is growing interest in silicone adhesives and encapsulants for terrestrial electronic packaging applications.